RF Measurements of Die and Packages

RF Measurements of Die and Packages
Pris
849,-
E-Bok
E-bøkene legges i din ARK-leseapp. Bøkene kan også lastes ned fra Din side.
×
Logg deg inn for å gjennomføre dette kjøpet med ett klikk!

Etter at kjøpet er gjennomført vil boken være tilgjengelig på «din side» og i ARK-appen
Format E-Bok
Kopisperre Teknisk DRM
Filformat PDF
Utgivelsesår 2002
Forlag Artech House
Språk Engelsk
ISBN 9781630810535
Se flere detaljer  

Om RF Measurements of Die and Packages

The explosion in the wireless industry, coupled with the higher frequencies in today's digital integrated circuits (IC) has made vital the need for accurate IC testing. This is the first book dedicated to the issues surrounding RFIC testing. An important resource for RFIC designers and high-frequency digital IC designers, IC test engineers, and IC manufacturing test engineers, this ground breaking resource helps you perform high-accuracy RF measurements of die and packages in the RF test lab, employ RF coplanar probes for accurate on-wafer characterization, and troubleshoot and utilize coplanar probes and test fixtures to extend their lifetime. Moreover, the book shows you how to build RF test systems for noise, high-power, and thermal testing, and de-embed the test system's parasitic effects to get the die's RF performance.This timely resource defines the essential elements in an RF system, explains where errors can be found in such a system, and shows how to mathematically remove them with calibration. It discusses the construction of both coplanar and high-volume testing membrane probes. The book details how to use coplanar probes to characterize individual die on the wafer, describes three popular RF test systems, and concludes with an explanation of how to characterize packages.


Kundevurderinger

ARKs anbefalinger

Det finnes ingen vurderinger av dette produktet. Skriv anmeldelse

Anbefalt


Tips en venn