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Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging ResearchBahgat G Sammakia, Madhusudan Iyengar og 1 annenInnbundetEngelskDel av serien Wspc Series In Advanced Integration And PackagingLegg i handlekurvNettlager
Solder MaterialsKwang-lung LinInnbundetEngelskDel av serien Wspc Series In Advanced Integration And PackagingLegg i handlekurvNettlager
Mems PackagingRamesh Ramadoss, Yu-ting Cheng og 1 annenInnbundetEngelskDel av serien Wspc Series In Advanced Integration And PackagingLegg i handlekurvNettlager
