Assembly and Reliability of Lead-Free Solder JointsJohn H. Lau, Ning-Cheng LeePocketEngelskLegg i handlekurvNettlager
Assembly and Reliability of Lead-Free Solder JointsJohn H. Lau, Ning-Cheng LeeInnbundetEngelskLegg i handlekurvNettlager
Chiplet Design and Heterogeneous Integration PackagingJohn H. LauInnbundetEngelskLegg i handlekurvNettlager
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out TechnologyJohn H. LauInnbundetEngelskLegg i handlekurvNettlager
Chiplet Design and Heterogeneous Integration PackagingJohn H. LauPocketEngelskLegg i handlekurvNettlager