RF and Microwave Microelectronics Packaging II
Av Ken Kuang (red), Rick Sturdivant (red)
Pocket
2018
Engelsk
It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
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