

Advanced Materials for Thermal Management of Electronic Packaging
2 654,-

Silicon Optoelectronic Integrated Circuits
1 952,-

Introduction to the Theory of Dielectric Resonators
1 592,-

Microwave Electronics
1 340,-

Load-Pull Techniques with Applications to Power Amplifier Design
1 592,-

Poly-SiGe for MEMS-above-CMOS Sensors
1 124,-

3D Microelectronic Packaging
1 952,-

Energy Harvesting for Wearable Sensor Systems
1 340,-

Microwave Electronics
1 340,-

Lattices of Dielectric Resonators
1 124,-

Advanced Materials for Thermal Management of Electronic Packaging
2 654,-

Silicon Optoelectronic Integrated Circuits
1 952,-

Introduction to the Theory of Dielectric Resonators
1 592,-

Microwave Electronics
1 340,-

Load-Pull Techniques with Applications to Power Amplifier Design
1 592,-

Poly-SiGe for MEMS-above-CMOS Sensors
1 124,-

3D Microelectronic Packaging
1 952,-

Energy Harvesting for Wearable Sensor Systems
1 340,-

Microwave Electronics
1 340,-

Lattices of Dielectric Resonators
1 124,-














