

Microwave Electronics
1 340,-

3D Microelectronic Packaging
1 952,-

Microwave Electronics
1 340,-

Advanced Materials for Thermal Management of Electronic Packaging
2 654,-

Field Emission Electronics
1 952,-

Introduction to the Theory of Dielectric Resonators
1 592,-

3D Microelectronic Packaging
1 952,-

Lock-in Thermography
1 709,-

3D Microelectronic Packaging
1 952,-

Load-Pull Techniques with Applications to Power Amplifier Design
1 592,-

Microwave Electronics
1 340,-

3D Microelectronic Packaging
1 952,-

Microwave Electronics
1 340,-

Advanced Materials for Thermal Management of Electronic Packaging
2 654,-

Field Emission Electronics
1 952,-

Introduction to the Theory of Dielectric Resonators
1 592,-

3D Microelectronic Packaging
1 952,-

Lock-in Thermography
1 709,-

3D Microelectronic Packaging
1 952,-

Load-Pull Techniques with Applications to Power Amplifier Design
1 592,-











